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US Patent Issued to Applied Materials on Sept. 1 for "Source drain formation in gate all around transistor" (California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,214, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Source drain formation in gate all around transistor... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Boundary gate structure for diffusion break in 3D-stacked semiconductor device" (New York Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,215, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Boundary gate structure for diffusion break ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Transistor protection layers and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,216, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Transistor protection layers and me... Read More


US Patent Issued to Korea Institute of Science and Technology on Sept. 1 for "Semiconductor device including trench with undercut structure and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,217, issued on Sept. 1, was assigned to Korea Institute of Science and Technology (Seoul, South Korea). "Semiconductor device including tre... Read More


US Patent Issued to ENKRIS SEMICONDUCTOR on Sept. 1 for "Semiconductor structure and method for manufacturing the same" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,218, issued on Sept. 1, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Semiconductor structure and method for manufacturing th... Read More


US Patent Issued to PROTERIAL on Sept. 1 for "Silicon carbide substrate having excellent flatness and low basal plane dislocation density" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,219, issued on Sept. 1, was assigned to PROTERIAL LTD. (Tokyo). "Silicon carbide substrate having excellent flatness and low basal plane di... Read More


US Patent Issued to SAMSUNG ELECTRONICS, Research & Business Foundation Sungkyunkwan University on Sept. 1 for "Semiconductor device comprising two-dimensional material and method of manufacturing the semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,220, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea) and Research & Business Foundation Sungkyunk... Read More


US Patent Issued to INNOSCIENCE (SUZHOU) SEMICONDUCTOR on Sept. 1 for "Semiconductor device including aluminum concentration that varies as an oscillating function and method for manufacturing the same" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,221, issued on Sept. 1, was assigned to INNOSCIENCE (SUZHOU) SEMICONDUCTOR Co. LTD. (Suzhou City, China). "Semiconductor device including a... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Transistor gate structures and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,222, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Transistor gate structures and meth... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Fin field-effect transistor device and method" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,223, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Fin field-effect transistor device ... Read More